//=URL?>
//=URL?>
//=URL?>
//=URL?>
- On the substrate ±3℃, In between substrates ±3℃
- Substrate stability : Minimizing warpage and shrinkage issues
- Thermal annealing process for high definition display above 400ppi
- Separate temperature control by chamber
- Separate moving control by chamber
- Hot wall type furnace
- Long lasting component with high durability
- Higer temperature needed at least 50℃~100℃ more compared to RTA process(650℃~720℃)
- 3times more cooling time and 1/3 times less processing speed needed compared to RTA process(<20℃/min)
- Upgrading throughput by High speed and temp. process
- Temperature uniformity:G-to-G,L-to-L,and Ch-to-Ch
- Rapid cooling :Controling shrinkage issue
- Controling warpage issue
- Minimizing pattern deviation (G-to-G & L-to-L variation)
- Rapid cooling system for controlling shrinkage issue
- Preventing warpage issue
- Excellent temp. uniformity and substrate stability
- Capability of handling larger size substrate up to 2~8 Gen
- No warpage issue even with thin substrate

Features
1
Temperature Uniformity GEN。2nd Glass~Gen。8th Glass)- On the substrate ±3℃, In between substrates ±3℃
2
High temperature Thermal process- Substrate stability : Minimizing warpage and shrinkage issues
- Thermal annealing process for high definition display above 400ppi
3
Optimized structure for multiple processes- Separate temperature control by chamber
- Separate moving control by chamber
4
Minimized heat loss- Hot wall type furnace
5
Low operating cost- Long lasting component with high durability
Applicable process
1
Pre-compaction- Higer temperature needed at least 50℃~100℃ more compared to RTA process(650℃~720℃)
- 3times more cooling time and 1/3 times less processing speed needed compared to RTA process(<20℃/min)
2
Changing a-si silicon status into poly silicon status- Upgrading throughput by High speed and temp. process
- Temperature uniformity:G-to-G,L-to-L,and Ch-to-Ch
- Rapid cooling :Controling shrinkage issue
- Controling warpage issue
3
Dopant activation- Minimizing pattern deviation (G-to-G & L-to-L variation)
- Rapid cooling system for controlling shrinkage issue
- Preventing warpage issue
4
De-Hydrogenation- Excellent temp. uniformity and substrate stability
- Capability of handling larger size substrate up to 2~8 Gen
- No warpage issue even with thin substrate