产品设资组合
  • 产品介绍
  • 产品现况
  • 产品设资组合
[LTPS] A-SPC Crystallization
_FE-RTA (A-SPC结晶化)
[LTPS] Pre-compaction
           (预收缩)
[LTPS] Hydrogenation
           (氢化)
[LTPS] Polyimide
Slit Die Coater
(PI缝隙钢型涂布机)
[LTPS] SGS Crystallization
_OE-RTA (SGS结晶化)
[LTPS] Dopant Activation
           (活化)
[LTPS] De-Hydrogenation
           (Low-temp.)
           (低温去氢)
HVCD
(Flexible机板预硬化)
[LTPS] De-Hydrogenation
           (high-temp.)
           (高温去氢)
[Oxide] IGZO Furnace
           (氧化物热处理)
[LTPS] Polyimide Curing
Furnace (Flexible PICF)
(PI硬化)
[Solar] TCO Coating
CIGS Selenization
(透明电极镀膜CIGS硒化)
[LTPS] Dopant Activation
           (活化)
R2R System
(Flexible机板涂布以及热处理)