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PIC

PIC Type设备是对作为最新趋势的POLED PI膜(Poly Imide)进行硬化的系统。

核心技术
  • High temperature heat treatment(<450℃)
  • Individual control possible for each area of flat IR heater
  • Excellent temperature uniformity(within ±3℃以内)
  • Independent fume exhaust system
  • Fast cooling speed
  • Low power consumption
工艺介绍

对POLED的PI进行硬化的过程。

SPEC

温度均匀度- within ± 3℃

适用领域

Flexible AMOLED

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