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LAB

LAB is a laser soldering system that uses a VCSEL laser to irradiate the substrate space with a uniform area laser for reflow and soldering bonding.

Core Technologies
  • VCSEL laser source
  • High precision laser heating
  • High heating rate
  • Large area multi chip process
Process

This process enables a large-area (300 mm) soldering bonding method using a surface emitting VCSEL laser that was impossible with conventional technologies and solves the warpage problem and thermal defects of advanced semiconductor packaging through high-temperature uniformity.

SPEC

Higher temperature uniformity ±3℃

Large size of 300 mm available

Applications

Semiconductor packaging

Die attach

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