HYBRID BONDER
Hybrid bonder is a direct bonding system that precisely aligns bumpless chips and wafer.
Core Technologies
- High resolution optic system
- Precise motion control stage
- Reliable pick and place system
Process
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After pre-processing the framed wafer and target wafer for room temperature bonding, the chip is bonded onto the wafer using a high-precision, high-speed Pick & Place.
SPEC
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Accuracy : 0.2㎛
UPH : 2,000 chips/hr
Applications
2.5D/3D chiplet packaing